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Key Benefits

Electronics Packaging and Sealing For Harsh Environments

As the breadth, functionally, and demand for electronic devices continues to grow in all markets, the need for reduction in package size and component cost has become of paramount importance.   These devices are also required to operate in increasingly extreme environments and with longer operational lifespans where failure in not an option.
High performance epoxy molding compounds combine dielectric, sealing and mechanical design elements in a one step overmolding process.  Eliminating process steps, components, potting compounds, and long cure times while integrating failure as mounting and electrical into a thin wall fully sealed package.

Low Pressure Electronic Device Overmolding with Epoxy Molding Compounds - Key Benefits