As the breadth, functionally, and demand for electronic devices continues to grow in all markets, the need for reduction in package size and component cost has become of paramount importance. These devices are also required to operate in increasingly extreme environments and with longer operational lifespans where failure in not an option.

INMAR offers engineering expertise and material solutions for revolutionary one step low pressure overmolding with high temperature resistant epoxy molding compounds. These high-performance epoxy molding compounds combine dielectric, sealing and mechanical design attributes in a one step overmolding process. Eliminating process steps, components, potting compounds, and long cure times while integrating interconnects connection and mounting features into a thin wall fully sealed package. These materials survive long term operational temperatures in excess of 200°C while providing hermetic sealing, reduced footprint, significant cost reductions and additional functionality to the packaging.

Epoxy molding compounds have been used extensively to encapsulate and protect sensitive electrical circuits in semiconductor microchips for decades. The inherent physical properties of thermoset epoxy molding compounds (EMC) protect these circuits from hostile environmental factors such as moisture, heat, and shock. INMAR leverages new and innovative EMC formulations in combination with highly automated low pressure injection molding to realize the same protection benefits in dramatically larger systems and more complex durable package designs.

Epoxy molding compounds fall into the category of thermosetting plastics. They are formed through a chemical reaction that forms long, 3-dimensional cross linked polymer chains. Epoxy molecular chemistries in combination with these chemically bonded polymer chains provide for a highly differentiated set of high-performance properties. Recent innovations in formulations and processing makes them highly suited for large scale electronics encapsulation and protection in very harsh environments.

Electronic control units (ECU) are generally a term used to describe the electrical devices in an automobile responsible for managing the operation of a variety electronic systems in the vehicle. Today a typical passenger car can contain more than 100 ECU’s, and many are required to operate in very extreme environments, with high temperature, vibration and fluid exposures, such as those in the different powertrain systems.

Dramatic Growth. Trends towards improved fuel economy, emissions reductions, safety, convenience, and overall vehicle electrification, intelligence and connectivity, are driving rapid growth in automotive electronics. Mechanical systems are increasingly being controlled by electrical systems or are being completely converted to electromechanical devices intelligently operated by sensors, microcontrollers, and actuators in looped feedback systems. As the number of these devices increases, complexity, functionality and cost do as well. They are being embedded into areas of increased exposures to heat, fluids, vibration and shock. These are also typically not easily serviceable therefore technical specifications and operational lifespans are becoming more demanding.

Failure is not an option. Any one of these systems has the potential to fail if not packaged, sealed and protected appropriately. These failures could cause significant damage, high repair costs, recalls, or in the worst scenario endanger lives. The temperature cycling, fluid exposures and mechanical vibrations and shock in these applications are far from ideal for the longevity of electronic assemblies. Traditional methods of packaging and protecting these sensitive electronics are being challenged in terms of long-term reliability, sealing performance, cost and overall size.

Innovative Solutions. These challenges are not unique to only the transportation sector, we see controllers being similarly challenged in nearly every sector. Improvements are needed on all fronts and INMAR is answering the challenge with new and highly innovative epoxy encapsulation solutions.