• Phone: (248) 766-7111
  • Info@inmar-solutions.com
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Electronics Packaging and Sealing For Harsh Environments

As the breadth, functionally, and demand for electronic devices continues to grow in all markets, the need for reduction in package size and component cost has become of paramount importance. These devices are also required to operate in increasingly extreme environments and with longer operational lifespans where failure in not an option.

INMAR offers engineering expertise and material solutions for revolutionary one step low pressure overmolding with high temperature resistant epoxy molding compounds. These high-performance epoxy molding compounds combine dielectric, sealing and mechanical design attributes in a one step overmolding process. Eliminating process steps, components, potting compounds, and long cure times while integrating interconnects connection and mounting features into a thin wall fully sealed package. These materials survive long term operational temperatures in excess of 200°C while providing hermetic sealing, reduced footprint, significant cost reductions and additional functionality to the packaging.

Epoxy Encapsulation Replaces Housings, Potting, Conformal Coating and Capillary Underfill in One Overmolding Step

Epoxy Encapsulation Key Benefits

Epoxy molding compounds have been used extensively to encapsulate and protect sensitive electrical circuits in semiconductor microchips for decades. The inherent physical properties of thermoset epoxy molding compounds (EMC) protect these circuits from hostile environmental factors such as moisture, heat, and shock. INMAR leverages new and innovative EMC formulations in combination with highly automated low pressure injection molding to realize the same protection benefits in dramatically larger systems and more complex durable package designs.

Cost Reduction

Replaces housings, potting, conformal coating and underfill


Up to 50% weight reduction vs tradition packaging methods


Improved long term durability in very harsh environments

Heat Dissipation

Thermal conductivity up to 5 W/mK


30-50% less packaging space required

Thin Wall Molding

Less than 200 micron

Key Properties for Electronics Encapsulation

Epoxy molding compounds fall into the category of thermosetting plastics. They are formed through a chemical reaction that forms long, 3-dimensional cross linked polymer chains. Epoxy molecular chemistries in combination with these chemically bonded polymer chains provide for a highly differentiated set of high-performance properties. Recent innovations in formulations and processing makes them highly suited for large scale electronics encapsulation and protection in very harsh environments.

Low Pressure Molding

No damage or stress to sensitive electrical device

Excellent Chemical Resistance

Long term property and sealing retention

High Glass Transition Temperatures

170-200°C, no delamination from substrates


Exceptional dielectric properties and volume resistivity with low ionic content

Excellent Moisture Resistance

Boiling water and steam resistant (autoclave capable)

Low Coefficient of Thermal Expansion

14-25ppm/°C = Low stress on electrical devices

Excellent Adhesion and Sealing

IP69K sealing to above 280°C

High Temperature Resistance

Long term to 280°C

Excellent Crack Resistance

No delamination or loss of sealing

Traditional Packaging and Sealing (ECU)

Simplified One Step Overmolding with Epoxy Molding Compound

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ELECTRIFICATION and CONNECTIVITY are not just trends in automotive and future mobility. The explosive growth in these technologies transcend into nearly every market, business sector, and product category. The unique attributes and benefits offered by encapsulation of electronics can be exploited in nearly every application where long term protection from environmental exposures is required.

EPOXY MOLDING COMPOUNDS offer a key benefit in that they can protect where other more costly, larger and more complex materials and packaging methods could and do fail. Whether it be the extreme temperatures, vibrations and fluid exposures an embedded control unit or sensor may experience inside of an automotive transmission; a sealed camera in a drone; the extreme temperatures and harsh chemicals a motor controller will experience in a down hole drilling operation; extreme weather exposure of a solar panel controller or junction box; or the electronics inside your favorite espresso machine, our epoxy encapsulation solutions have your electronics covered…..literally.

INMAR has a solution to ruggedize and bring high reliability to your electronics no matter where they may live.



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Electronic Control Unit/PCBA Encapsulation

Electronic control units (ECU) are generally a term used to describe the electrical devices in an automobile responsible for managing the operation of a variety electronic systems in the vehicle. Today a typical passenger car can contain more than 100 ECU’s, and many are required to operate in very extreme environments, with high temperature, vibration and fluid exposures, such as those in the different powertrain systems.

Dramatic Growth. Trends towards improved fuel economy, emissions reductions, safety, convenience, and overall vehicle electrification, intelligence and connectivity, are driving rapid growth in automotive electronics. Mechanical systems are increasingly being controlled by electrical systems or are being completely converted to electromechanical devices intelligently operated by sensors, microcontrollers, and actuators in looped feedback systems. As the number of these devices increases, complexity, functionality and cost do as well. They are being embedded into areas of increased exposures to heat, fluids, vibration and shock. These are also typically not easily serviceable therefore technical specifications and operational lifespans are becoming more demanding.

Failure is not an option. Any one of these systems has the potential to fail if not packaged, sealed and protected appropriately. These failures could cause significant damage, high repair costs, recalls, or in the worst scenario endanger lives. The temperature cycling, fluid exposures and mechanical vibrations and shock in these applications are far from ideal for the longevity of electronic assemblies. Traditional methods of packaging and protecting these sensitive electronics are being challenged in terms of long-term reliability, sealing performance, cost and overall size.

Innovative Solutions. These challenges are not unique to only the transportation sector, we see controllers being similarly challenged in nearly every sector. Improvements are needed on all fronts and INMAR is answering the challenge with new and highly innovative epoxy encapsulation solutions.

Engine Control Units
Battery Mgmt System Control Units
Electric Motor Controllers
Transmission Control Units
Inverter Control Units
Hydraulic Systems Control Units

Power Electronics Encapsulation

Market Growth.  Power modules have been widely used in power conversion  equipment in industrial, consumer, and renewable energy markets and are now rapidly expanding into hybrid and electric vehicle applications.  With this growth comes the need for improved efficiencies, reduced costs, higher operating temperatures and improved reliability.  Silicone gel potting compounds traditionally have been used to seal and protect the circuitry, however, these new demands are exceeding their capabilities.

Size and Cost Reduction.  Epoxy molding compounds enable overall package size and cost reduction  by eliminating the plastic housings and replacing expensive, long cure time potting processes with a short cycle multicavity injection or transfer molding process.

High Reliability.  These new low Coefficient of Thermal Expansion (CTE), high Glass Transition Temperature (Tg) epoxies have also demonstrated the ability to reduce component stresses, improve long term reliability and enable junction temperatures greater than 200°C.

Enhanced Heat Removal.  The process also provides the ability to integrate additional cooling mechanisms and features directly into the module, such as the use of thermally conductive epoxy formulations.  When higher levels of heat removal are required, copper or aluminum heat sinks for direct liquid cooling can be inserted into  the molding process for in very compact sealed package in a wide array of design configurations.


Sensor Encapsulation

INMAR has helped customers with sensor packaging design across many markets, many platforms, and many different environments. We help specify appropriate materials, molding, and assembly methods that meet all applications requirements.  Direct overmolded epoxy encapsulations have become our method of choice to provide the smallest form factor, most cost-effective packaging, especially when it comes to long term reliability in  harsh environments.   

Epoxy’s inherent temperature, chemical and moisture resistance, combined with excellent adhesion properties, allow sensors to be placed into service in a multitude of different applications and environments.  Whether they require IP69K level sealing in a high pressure wash down for the food and beverage market; chemical, temperature and vibration resistance for IIOT equipment monitoring in a chemical processing plant; or very thin wall hall sensor overmolding for position sensing while embedded deep in an automotive transmission; these materials provide proven long-term reliability.

Low pressure injection molding with this new generation of high-performance materials enables encapsulation of some of the most sensitive devices and can provide high reliability for just about any sensor type.

Radio Frequency
Transmission Hall Effect Speed Sensor
Intelligent Battery Sensor - IBS/SOC
E - Mobility
RFID - Proximity Sensor
Industrial IOT
Industrial IOT

Electric Motors/Actuators

INMAR focuses on these key areas for E-motor/actuator/magnetic field coil encapsulation:

Smart Coil Encapsulation: INMAR refers to smart coils as any coil that has a sensing or controlling element within it.  For example, a PCBA motor controller directly connected to a stator coil and overmolded together in one step.  This includes very fine wire winding such as those found antennae for NFC communication or wireless charging devices where very low shear thin layer cladding is required to not sweep or break the wire or wire bond/solder joints.

Thermal Dissipation:  Heat reduces electric motor power output and reduces its life.  Encapsulation with epoxy can provide significant temperature reductions, especially when using thermally conductive grades (1-5 W/mK). Reductions in thermal rise leads to increased thermal efficiency of the E-machine and benefits such as increased torque and power, longer life, and the ability to downsize the motor for cost and weight reductions.

Magnet Bonding and Sealing.  INMAR has developed the lowest cost method of bonding permanent magnets into rotors and stators for a variety of electric machines including the growing use in traction motors and generators for EV/HEV applications.  By leveraging the inherent process efficiencies of traditional injection molding we are able to provide full magnet coverage into very narrow gaps, while providing very short cycle times and the lowest levels of material waste.

Cost Reduction.  Encapsulation with epoxy offers dramatic opportunities for cost reduction by replacing machined metal housings, seals and potting compounds, interconnect insulators, and eliminating multiple assembly steps.

Electric Oil Pump
Electric Vehicle Traction Motor
E - Mobility
Bring us your electronics packaging challenge